Printed circuit board laboratory
Tests are performed on solder materials such as printed circuit boards (PCBs) and electronic components. We perform solderability tests, metallographic examinations of PCB solder joints and electronic components, determine the glass transition temperature Tg for PCB – DSC and the chemical composition of the solders.
Activities of printed circuit board laboratory
Tests are performed on solder materials such as:
- printed circuit boards (PCBs),
- electronic components.
Tests:
- solderability,
- metallographic tests of PCB soldered joints and electronic components,
- determination of glass transition temperature Tg for PCB – DSC.
Printed circuits
The parameters according to the requirements of DIN EN 62326 or IPC-A-600G are tested on printed circuit boards. The methods are given in EN 61189. We test the following parameters:
- soldering before and after accelerated aging tests,
- resistance of the soldering resist to the soldering temperature,
- adhesion of the solder cover after (adhesive tape method),
- measurements of metal coating thicknesses: Sn, SnPb, Au, Cu and Ni in boreholes and at the connections,
- microscopic examination of solder holes,
- measurements of component pull-out forces,
- determination of the chemical composition of solders and assessment of the suitability of materials according to the RoHS directive,
- determination of glass transition temperature Tg for PCB – DSC.
Metallographic tests:
- measurements of metal coating thicknesses: SnPb, Sn, Au, Cu and Ni in boreholes and connections,
- microscopic examination of soldered holes.
Chemical composition of solder materials:
- determining the chemical composition of solder wires, pastes and liquids and and assessing the suitability of component materials according to the RoHs directive.
Electronic components:
- solderability tests,
- assessment of the suitability of components according to the RoHS directive.
Solder wires, solder fluids, solder pastes
We test the parameters according to the requirements of DIN EN 29453, EN 29454, DIN 32513:
- solder spillage,
- solder injection.
- solder fluid content, dry residue, neutralisation number,
- solder fluid spatter,
- corrosive effect on copper (IEC 60068-2-3 Test Ca),
- density,
- % dry matter,
- “”Solder Ball Test””,
- “”Slump Test””,
- determination of chemical composition.